产品尺寸图： | PART NO. （型号） | CHIP | Lens Color | | Material | Source Color | | 3014白光 | ALInGaP | White（白色） | yellow（黄色） |
Notes:1. All dimensions 1.所有单位是毫米（英寸）2.允许误差为正负0.25mm,除非另行通知。3.规格可能随时有变化，不另行通知。4.本数据有效期为六个月Absolute Maximum Ratings at TA=25℃ Parameter(参数) | Valce（标准值） | Unit（单位） | | Power Dissipation（消耗功率） | 120 | mW | | Pilsed Forward Current（脉冲顺向电流）(1/10 Duty Cycle, 0.1ms Pulse width | 100 | mA | | Continuous Forward Current（连续工作电流） | 30 | mA | | Derating Linear From 50℃（电流比例关系） | 0.4 | mA /℃ | | Reverse Voltage（反向电压） | 5 | V | | Operation Temperature Range（工作温度） | -40℃ to +80℃ | | Storage Temperature Range（储存温度） | -40℃ to +80℃ | | Lead Soldering Temperature[4mm (.157”) From Body]（焊接温度） | 260℃ for 5 Seconds（260度下不超过5秒） |
Electrical / Optical Characteristics at TA=25℃| Parameter（参数） | Symbol标志 | Min.最小值 | Typ.中间值 | Max.最大值 | Unit单位 | Test Condition测试条件 | | Luminous Intensity（光通量） | Φ | 10 | 11.5 | 14 | Lm | IF=30mA Note 1.4 | | Source color(发光颜色) | CCT | 6000 | | 6500 | K | IF=30mA Note4 | | Viewing Angle（发光角度） | 2θ1/2 | 115 | 120 | 125 | deg | Note 2 | | Forward Voltage（正向电压） | VF | 3.0 | 3.2 | 3.4 | V | IF=30mA | | Reverse Current（反向电流） | IR | - | - | 5 | μA | VR=5V |
Note：1.Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commission International De L’Eclairage) eye-response curve. 2.1/2 is the off-axis angle at which the luminous intensity is half the axial luminous and intensity. 3.The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4.The IV guarantee should be added ±15%. 特性曲线图 Forward Current Relative Luminous IntensityIF= f (VF); TA= 25 °C IV/IV(30mA) = f (IF); TA= 25 °CReflow Soldering Instructions(回流焊说明)1.Number of reflow process shall be less than 2 times and coolingprocess to normal temperature is required between first and Second soldering process.(本产品最多只可回焊两次,且在首次回焊后须冷却至室温之后方可进行第二次回焊.)2.When soldering, do not put stress on the LEDS during heating.(高温焊接时，不能外加压力在LED上.)3.After soldering,do not warp the circuit board.(焊接完成后，不能弯曲线路板.)1>Lead Solder（有铅回焊）Recommended Soldering Patter(n推荐焊盘式样)(单位:毫米) |
